technical data sheet 1 / 4 right angle jack receptacle for pcb r124.681.000 smt type series : sma-com issue : 0430 b in the effort to improve our products, we reserve the right to make changes judged to be necessary. all dimensions are in mm. .. pn ao components body center contact outer contact insulator gasket others parts - - materials brass beryllium copper - ptfe - - - - platings ( m ) gold 0.2 over nickel 2 gold 0.5 over nickel 2 - - - -
technical data sheet 2 / 4 right angle jack receptacle for pcb r124.681.000 smt type series : sma-com issue : 0430 b in the effort to improve our products, we reserve the right to make changes judged to be necessary. packaging specification s tandard u nit o ther 1 00 ? w? option c ontact us electrical characteristics environmental i mpedance 5 0 ? o perating temperature - 65/+165 c f requency 0 -6 g hz h ermetic seal n a a tm.cm3/s v swr 1 .16 + 0 .000 x f( g hz) maxi p anel leakage n a i nsertion loss 0 .07 f ( g hz) db maxi r f leakage - ( 6 0 - f(ghz)) db maxi v oltage rating 5 00 v eff maxi d ielectric withstanding voltage 1 000 v eff mini insulation resistance 5000 m ? mini others characteristics assembly instruction na o thers : - mechanical characteristics c enter contact retention axial force ? mating end 1 5 n mini axial force ? opposite end 1 5 n mini torque 1 n.cm mini r ecommended torque mating 4 0 n.cm panel nut n a n.cm m ating life 1 00 c ycles mini w eight 3 .000 g
technical data sheet 3 / 4 right angle jack receptacle for pcb r124.681.000 smt type series : sma-com issue : 0430 b in the effort to improve our products, we reserve the right to make changes judged to be necessary. serie sma - information coplanar line pattern and signal are on the same side thickness of pcb : .063 (1.6 mm) the material of pcb : epoxy resin (er=4.8) the solder resist should be printed except for the land pattern on the pcb shadow of receptacle for video camera
technical data sheet 4 / 4 right angle jack receptacle for pcb r124.681.000 smt type series : sma-com issue : 0430 b in the effort to improve our products, we reserve the right to make changes judged to be necessary. solder procedure 1. deposition of solder paste ?sn ag4 cu0.5? on mounting zone by screen printing application. we recommend a low residue flux. we advise a thickness of 150 microns ( 5.850 microinch ). verify that the edges of the zone are clean. 2. placement of the receptacle on the mounting zone with an automatic machine of ?pick and place? type. video camera is recommended for the positioning of the component. adhesive agents must not be used on the receptacle. 3. soldering by infra-red reflow. below, please find the typical profile to use. 4. cleaning of printed circuit boards. 5. checking of solder joints and position of the component by visual inspection. temperature profile parameter value unit temperature rising area 1 - 4 c/sec max peak temperature 260 c max dwell time @260c 10 sec min dwell time @235c 20 sec max dwell time @235c 60 sec temperature drop in cooling area -1 to - 4 c/sec max dwell time above 100c 420 sec
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